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Countering Tesla's self-driving chip, NVIDIA emphasizes the importance of open platform
Countering Tesla's self-driving chip, NVIDIA emphasizes the importance of open platform2019-05-06

Tesla has announced the launch of its self-developed Full Self-Driving (FSD) chip, which is designed with dual processor chips and manufactured on Sam...

Toy products gradually become AI! Drive the performance of this IC design company to return
Toy products gradually become AI! Drive the performance of this IC design company to return2019-05-04

Toy IC design company Generalplus announced the first quarter earnings report, single-quarter consolidated revenue of 529 million Taiwan dollars (the ...

The University of Texas has developed a new technology that increases the sensitivity of semiconductor measurement by 100,000 times
The University of Texas has developed a new technology that increases the sensitivity of semiconductor measurement by 100,000 times2019-05-03

According to the James Consulting, the University of Texas (UT) researchers have developed a new semiconductor measurement technology that is 100,000 ...

Western Digital begins shipping consumer-grade flash based on 96-layer BICS4 3D NAND
Western Digital begins shipping consumer-grade flash based on 96-layer BICS4 3D NAND2019-05-02

Western Digital is continuing to increase its production of 96-story BICS4 3D NAND, which has been used in various retail storage devices for a year o...

Samsung announced first-quarter earnings: semiconductor business plunged 64%, panel business losses
Samsung announced first-quarter earnings: semiconductor business plunged 64%, panel business losses2019-05-01

According to Reuters, Samsung announced its first quarter earnings. The data showed that operating profit for the first quarter was $5.4 billion, and ...

Kirin 985 chip will be mass-produced in the third quarter, but abandoned TSMC InFO process
Kirin 985 chip will be mass-produced in the third quarter, but abandoned TSMC InFO process2019-04-30

According to Digitimes, supply chain sources revealed that Huawei HiSilie will mass-produce the Kirin 985 chip using TSMC's 7nm enhanced process in th...

Qualcomm chip vulnerability? Do not be afraid! Patch repairs have been available since October 2018
Qualcomm chip vulnerability? Do not be afraid! Patch repairs have been available since October 20182019-04-29

On April 28, Qualcomm said that the Qualcomm chip, numbered CVE-2018-11976 discovered by NCC Group last March, had provided security patches to termin...

Intel promises no more chip shortages, giving priority to multi-core processors
Intel promises no more chip shortages, giving priority to multi-core processors2019-04-28

According to "PC World", Intel's new CEO Bob Swan said on Thursday that the company's manufacturing process will no longer be a stumbling block to cus...

Accelerate the
Accelerate the "data center priority" strategy! Xilinx Announces Acquisition of Communications Company Solarflare2019-04-26

On April 25, Xilinx, a global leader in programmable logic solutions, announced that it has reached a definitive agreement to acquire Solarflare Commu...

Intel Introduces 2nd Generation Xeon Series Processors to Accelerate Global Data Processing
Intel Introduces 2nd Generation Xeon Series Processors to Accelerate Global Data Processing2019-04-25

Intel released a multi-series of technologies and products on the 24th, including Intel Business Director Zheng Zhicheng, which introduced the second ...

In the past two years, TSMC has taken eight of the world's best! Come see what are there
In the past two years, TSMC has taken eight of the world's best! Come see what are there2019-04-24

At the North American Technology Forum, TSMC pointed out that TSMC has achieved eight industry-leading achievements in advanced technology and packagi...

TSMC completes the world's first 3D IC package, Apple may be the first customer
TSMC completes the world's first 3D IC package, Apple may be the first customer2019-04-23

TSMC's one-stop layout has broken through and completed the world's first 3D IC package, which is expected to be mass-produced in 2021. The industry b...

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